Overview Join our team to lead the design and development of cutting-edge IC packaging solutions for advanced laser and opto-electronic ASIC chips. This role bridges hardware and manufacturing engineering, driving innovation from concept to production. Base pay range $150,000.00/yr - $180,000.00/yr Location: San Francisco, CA (some travel required) What You’ll Do 50% Collaborate with hardware engineers on package design 50% Partner with manufacturing engineers to build and implement designs Act as the communication bridge between design and build teams Direct vendors producing components like substrates, epoxies, coated glass, PCBAs, and tooling Responsibilities Own end-to-end IC package design, simulation, and development Collaborate across disciplines to build robust packages for harsh environments Transition prototypes to high-volume production Define reliability test plans and conduct failure analysis Manage sourcing, quoting, and low-volume orders Required Skills & Experience 5+ years in semiconductor packaging or 2+ years with a relevant master’s degree Proficiency in 3D CAD (SolidWorks) and FEA tools (ANSYS) Hands-on experience with die bonding, wirebonding, and optical alignment Familiarity with ceramic, CMOS, BGA, and organic substrates Wafer-level processing and failure analysis expertise Experience with optical systems (LiDAR, cameras, microscopes) Plusses Degree in Materials Science, EE, ME, or related field Statistical analysis for volume production Automated microelectronic/photonic assembly experience Details Seniority level: Associate Employment type: Full-time Job function: Manufacturing Industries: Manufacturing We’re unlocking community knowledge in a new way. Experts add insights directly into each article, started with the help of AI. #J-18808-Ljbffr Insight Global
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